First, the PCB process profile
*Single panel process
Cutting edge → Drilling → Outer drawing → (Full plate gold plating) → Etching → Inspection → Silk screen resistance welding → (Hot air leveling) → Silkscreen character → Outline processing → Test → Inspection
*Double-panel spray tin plate process
Cutting edge → Drilling → Thickening of copper → Thickness of outer layer → Tin plating, Etching of tin → Secondary drilling → Inspection → Silk screen printing → Gold-plated plug → Hot air leveling → Silkscreen character → Outline processing → Test → test
*Double plate nickel plating process
Cutting edge → Drilling → Thickening of copper → Outer drawing → Nickel plating, Gold film etching → Secondary drilling → Inspection → Silk screen resistance welding → Silkscreen character → Outline processing → Test → Inspection
*Multilayer PCB spray tin plate process
Cutting edge → Drilling positioning hole → Inner layer pattern → Inner layer etching → Inspection → Blackening → Lamination → Drilling → Thickening of copper → Outer drawing → Tin plating, Etching of tin → Secondary drilling → Inspection → silk screen resistance welding → plating Gold plug → hot air leveling → silk screen characters → shape processing → test → test
*Multilayer Plating Nickel Plating Process
Cutting edge → Drilling positioning hole → Inner layer pattern → Inner layer etching → Inspection → Blackening → Lamination → Drilling → Thickening of copper → Outer drawing → Gilded, Membrane etching → Secondary drilling → Inspection → Silk screen resistance welding → silk Print character → shape processing → test → test
*Multi - layer plate nickel - nickel plate process
Cutting edge → Drilling positioning hole → Inner layer pattern → Inner layer etching → Inspection → Blackening → Lamination → Drilling → Thickening of copper → Outer drawing → Tin plating, Etching of tin → Secondary drilling → Inspection → silk screen resistance welding → of the Learning nickel gold → silk screen characters → shape processing → test → test;
Second, the main technical indicators
1 . Maximum processing size: single, double Panel: 1200mm * 600mm Multilayer board: 400mm * 600mm
2 ．Processing board thickness： 0.3mm -4.0mm
3 ．Thickness of substrate copper foil： 18μ(1/ 2OZ ),35μ( 1OZ ),70μ( 2OZ )、105μ( 3OZ )
4 ．Commonly used substrates： FR-4 ， CEM-3 ， CEM-1, Polytetrafluoroethylene、FR-1（94V0、94HB）
Third, the process capacity：
（ 1 ）Drilling: minimum aperture 0.2MM
（ 2 ） Hole metallization: minimum pore size0.2mm
（ 3 ） Minimum line width: 0.10mm
（ 4 ） Gold Plating: Thickness of nickel：〉or =2.5μ 　　Gold layer thickness： 0.05-0.1μm Or according to customer requirements
（ 5 ） Spray tin plate: tin layer thickness： > or =2.5-5μ
（ 6 ） Milling board: the minimum distance from the line to the edge： 0.15mm 　Hole to edge minimum distance: 0.15mm 　Minimum shape tolerance： ± 0.1mm
（ 7 ） Socket chamfer: angle: 30 degrees, 45 degrees, 60 degrees depth： 1 -3mm
（ 8 ） V cut: angle: 30 degrees, 35 degrees, 45 degrees depth: thickness 2/3